Method for forming a pickup area of a board level shield

ABSTRACT

A method includes raising a pickup area of a pickup member including one or more arms extending between the pickup area and one or more sidewalls of a frame of a board level shield (BLS), such that the pickup area is raised relative to and above an upper surface of the one or more sidewalls of the frame, and such that the pickup area rotates in place as the pickup area is raised relative to and above the upper surface of the one or more sidewalls.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to and the benefit of U.S. ProvisionalPatent Application No. 62/469,978 filed Mar. 10, 2017 and U.S.Provisional Patent Application No. 62/615,320 filed Jan. 9, 2018. Theentire disclosures of the above applications are incorporated herein byreference.

FIELD

The present disclosure generally relates to board level shield (BLS)frames including pickup members with pickup areas. The pickup member maybe configured such that the pickup area is allowed to rotate in placewhen the pickup member is drawn to raise the pickup area.

BACKGROUND

This section provides background information related to the presentdisclosure which is not necessarily prior art.

A common problem in the operation of electronic devices is thegeneration of electromagnetic radiation within the electronic circuitryof the equipment. Such radiation may result in electromagneticinterference (EMI) or radio frequency interference (RFI), which caninterfere with the operation of other electronic devices within acertain proximity. Without adequate shielding, EMI/RFI interference maycause degradation or complete loss of important signals, therebyrendering the electronic equipment inefficient or inoperable.

A common solution to ameliorate the effects of EMI/RFI is through theuse of shields capable of absorbing and/or reflecting and/or redirectingEMI energy. These shields are typically employed to localize EMI/RFIwithin its source, and to insulate other devices proximal to the EMI/RFIsource. For example, board level shields are widely used to protectsensitive electronic devices against inter and intra systemelectromagnetic interferences and reduce unwanted electromagneticradiations from a noisy integrated circuit (IC).

The term “EMI” as used herein should be considered to generally includeand refer to EMI emissions and RFI emissions, and the term“electromagnetic” should be considered to generally include and refer toelectromagnetic and radio frequency from external sources and internalsources. Accordingly, the term shielding (as used herein) broadlyincludes and refers to mitigating (or limiting) EMI and/or RFI, such asby absorbing, reflecting, blocking, and/or redirecting the energy orsome combination thereof so that it no longer interferes, for example,for government compliance and/or for internal functionality of theelectronic component system.

DRAWINGS

The drawings described herein are for illustrative purposes only ofselected embodiments and not all possible implementations, and are notintended to limit the scope of the present disclosure.

FIG. 1 is a perspective view of an exemplary embodiment of a frame orfence of a board level shield (BLS) that includes a pick and placebridge (broadly, a pickup member) having a pick and place island(broadly, a pickup area). In FIG. 1, the BLS frame is shown after thebridge has been drawn to raise the island above a top of the BLS frame'ssidewalls.

FIG. 2 is a top view of the BLS frame shown in FIG. 1.

FIG. 3 is a bottom view of the BLS frame shown in FIG. 1.

FIG. 4 is a front view of the BLS frame shown in FIG. 1, and showing arelative height of the island to the top of the front wall after theisland is raised during the drawing process.

FIG. 5 is a perspective view of an exemplary embodiment of a BLS frameor fence that includes a pick and place bridge having a pick and placeisland.

FIG. 6 is a bottom perspective view of the BLS frame shown in FIG. 5after the bridge has been drawn and the island was allowed to rotate inplace.

FIG. 7 is a perspective view of the BLS frame shown in FIG. 6.

FIG. 8 illustrates an exemplary offset of an arm-to-island attachment ofa bridge according to an exemplary embodiment.

FIGS. 9, 10, and 11 illustrate an exemplary embodiment of a BLS frame orfence that includes a pick and place bridge having a pick and placeisland. In FIG. 9, U1 refers to displacement in millimeters (mm) alongthe X axis. In FIGS. 10 and 11, S refers to stress with the type beingVon Misses in megapascals (MPa).

FIG. 12 illustrates an exemplary embodiment of a BLS frame or fence thatincludes a removable pick and place bridge having a pick and placeisland with three attachment points.

Corresponding reference numerals indicate corresponding parts throughoutthe several views of the drawings.

DETAILED DESCRIPTION

Example embodiments will now be described more fully with reference tothe accompanying drawings.

Frames or fences of conventional two-piece board level shields aregenerally made from sheet metal materials that have good formality andstiffness. The ability to add drawn features to BLS frames or fencesallows for features like a raised up “pick and place” island. A raised“pick and place” island may advantageously allow for better componentclearance during the soldering operation. A raised “pick and place”island may also allow for easier removal of the “pick and place” bridgeafter soldering. A raised “pick and place” island may further allow fora lower soldered down frame height, which, in turn, may provide a fullmaterial thickness advantage.

One of the difficulties encountered when adding a drawn (raised) “pickand place” bridge is that drawing process adds residual stress to thepart, which can make meeting co-planarity (flatness) tolerances harderto achieve. Also, this residual stress may potentially cause a soldereddown frame to twist out of the desired flat shape and/or potentiallycause the frame to lift up off the soldered surface (e.g., substrate orboard of a printed circuit board (PCB), etc.) during the reflow solderoperation. As disclosed and recognized herein, it would be desirable andprovide a design advantage to allow a center island (broadly, a pickuparea) of the “pick and place” bridge (broadly, a pickup member) torotate in place during the drawing process, to thereby reduce the neededelongation of the drawn metal “pick and place” bridge. Reducing themetal elongation will advantageously reduce the residual stress of thepart, thus allowing for tighter or superior co-planarity (flatness)tolerances.

Accordingly, disclosed herein are exemplary embodiments of a BLS frameor fence that includes a pick and place bridge (broadly, a pickupmember) having a pick and place island (broadly, a pickup area). Theisland is rotatable in place when the bridge is being drawn to raise theisland above a top of the BLS frame's sidewalls. The rotation of theisland helps reduce the needed elongation of the drawn material (e.g.,drawn metal, etc.). Reducing the material elongation helps reduce theresidual stress of the part (e.g., reduces residual stresses of thebridge's arms, island, and bridge-to-island attachments, etc.). Thereduction in residual stress allows for superior or tighter co-planarity(flatness) tolerances.

In exemplary embodiments, the bridge-to-island attachments arepurposefully offset (e.g., FIG. 8, etc.) so that the island is stillgenerally centered relative to the center of mass and/or to thefootprint or perimeter defined by the BLS frame's sidewalls after theisland rotation during the drawing process. For example, abridge-to-island attachment may be configured to have a reduced width ascompared to the width of the corresponding bridge arm, leg, or crossmember. A bridge-to-island attachment may be configured such that it isplanar or in the same plane as the island and the corresponding bridgearm or leg.

The X-Y position of the island relative to the BLS frame's sidewalls maybe the same or substantially the same before and after the drawingprocess as only the Z-position or height of the island relative to theBLS frame's sidewalls significantly changes during the drawing process.In some exemplary embodiments, the bridge includes a circular islandhaving a center that is generally centered or centrally located relativeto the center of mass and/or the perimeter or footprint defined by BLSframe's sidewalls both before and after the drawing process. During thedrawing process, the island may rotate in place in the X-Y plane withoutany (or without any significant) translational/linear motion of thecenter of the island in either the X or Y directions. The x-y positionof the island may be unchanged during the drawing process.

In exemplary embodiments, the bridge-to-island attachments arepurposefully offset in the tooling when the pickup member or bridge ismade. The attachment of the arms/legs may be offset from the centerlineof the pickup circle or island. The offset creates a moment from which,when the arm/leg is put under tension, the pickup island is rotatedinstead of stretching the arm/leg. The pick bridge may be removed afterinstallation of the BLS frame, e.g., after the BLS frame has beensoldered to a PCB, etc.

In exemplary embodiments, a majority of the surface of the arms/legs andthe center pickup island may be co-planar. A jog (e.g., a Z bend, angledportion, etc.) may be provided in each of the arms/legs, such that theconnection point from each arm/leg to the frame may be co-planar with atop of the frame's sidewalls. The jog in each arm/leg (e.g., adjacentthe walls of the frame or fence, etc.) creates a secondary plane, whichincludes the remaining length of each leg along with the center pickupisland. The pickup island may be configured to be coplanar with andremain coplanar with the top surface of the arms/legs to help ensureaccuracy of the pick and place operation when the BLS frame or fence isplaced onto a substrate (e.g., PCB, etc.).

Exemplary embodiments disclosed herein may provide one or more (but notnecessarily any or all) of the following features or advantages oversome existing board level shields. For example, exemplary embodimentsdisclosed herein may eliminate the need to stretch or elongate the armsor legs of the pickup bridge when raising the pickup member (e.g.,circular pickup island, etc.) during a drawing process. This may allowfor reduced residual or forming stresses, which is a benefit toimproving flatness capability.

With reference to the figures, FIGS. 1 through 4 illustrate an exemplaryembodiment of a frame or fence 100 of a board level shield (BLS)embodying one or more aspects of the present disclosure. As shown, theBLS frame 100 includes a pick and place bridge 104 (broadly, a pickupmember) having a pick and place island 108 (broadly, a pickup area) andfour arms or legs 112 (broadly, members). Each arm or leg 112 extendsgenerally between a corresponding sidewall 116 (or flange) of the frame100 to the island 108. An attachment or connection 120 (e.g., fixedconnection, removably detachable connection, etc.) is between the island108 and each arm 112. Another attachment or connection 122 (e.g., fixedconnection, removably detachable connection, etc.) is between each arm112 and the corresponding sidewall 116 of the frame 100.

In FIG. 1, the BLS frame 100 is shown after the bridge 104 has beendrawn to raise the island 108 above a top of the BLS frame's sidewalls116. During the drawing process, the island 108 was allowed to rotate inplace with counterclockwise rotation in the X-Y plane without any (orwith any significant) translational/linear motion of the center of theisland 108 in either the X or Y directions. Accordingly, the x-yposition of the island 108 may be unchanged during the drawing process.In this example, the island 108 may be positioned at about the center ofmass of the BLS frame 100 before the drawing process. And, the x-ylocation of the island 108 may remain at about the center of mass of theBLS frame 100 after the island 108 is raised by the drawing process.

The arm-to-island attachments 120 may be offset so that the island 108is still generally centered relative to the footprint or perimeterdefined by the BLS frame's sidewalls 116 after the island rotationduring the drawing process. In this example, the attachment of thearms/legs 112 to the island 108 are offset from the centerline of thecircular pickup island 108. By being offset, the drawing process createsa moment from which, when the arm/leg 112 is put under tension, thepickup island 108 is rotated instead of stretching the arm/leg 112. Byway of example, FIG. 8 shows a starting location of an island attachmentthat is offset by 0.125 mm from center. The attachments 120 may alsohave a reduced width as compared to the width of the corresponding arms112.

The attachment 120 may be configured such that the material defining theattachments 120 is initially planar or in the same plane as the island108 and the corresponding bridge arm or leg 112 before drawing thebridge 104 to raise the island 108. A majority of the surface of thearms/legs 112 and the center pickup island 108 may be co-planar. A jog118 (e.g., a Z bend, upwardly angled or slanted portion, etc.) may beprovided in each of the arms/legs 112, such that the connection point122 from each arm/leg 112 to the frame 100 is co-planar with a top ofthe frame's sidewalls 116. The jog 118 in each arm/leg 112 (e.g.,adjacent the walls of the frame or fence, etc.) creates a secondaryplane, which includes the remaining length of each leg 112 along withthe pickup island 108. The pickup island 108 may be configured to becoplanar with and remain coplanar with the top surface of the pickupmember 104 to help ensure accuracy of the pick and place operation whenthe BLS frame or fence 100 is placed onto a substrate (e.g., PCB, etc.).As shown in FIG. 4, each jog 118 may comprise a portion that extendsupwardly at an angle (e.g., 45 degrees, 60 degrees, other acute angle,etc.) that allows the connection 122 from the corresponding arm/leg 112to the frame 100 to be co-planar with a top of the frame's sidewalls 116and that allows the pickup island 108 to be co-planar with the remainderof the corresponding arm/leg 112 that extends between the jog 118 andthe pickup island 108.

The X-Y position of the island 108 relative to the BLS frame's sidewalls116 may be the same or substantially the same before and after thedrawing process as only the Z-position or height of the island 108relative to the BLS frame's sidewalls 116 changes (raised) significantlyduring the drawing process. In some exemplary embodiments, the island orpickup area 108 is circular with a center that is generally centered orcentrally located relative to the perimeter or footprint defined by BLSframe's sidewalls 116 both before and after the drawing process.Alternatively, the pickup area 108 may be configured differently, e.g.,have a non-circular shape, a different location, etc.

The island or pickup area 108 is configured (e.g., sized, shaped,located, etc.) to enable the bridge 104 to be picked up by a headassociated with pick-and-place equipment, such as by a suction nozzle,gripper, or other pickup features. For example, the pickup area 108 maybe configured to allow the frame 100 and bridge 104 to be picked up,moved, and placed onto a PCB with pick-and-place equipment (e.g., vacuumpick-and-place equipment, etc.). The pick-up area 108 may be configuredfor use as a pick-up area that may be gripped or to which suction may beapplied by the pick-and-place equipment for handling during originalinstallation of the frame 100 to a PCB. The pick-up area 108 may begenerally centrally located, etc. to allow for balanced manipulation ofthe frame 100 during handling. In other exemplary embodiments, a frame100 may also include tabs at corners and/or along the side edges for useas additional pick-up surfaces.

In this illustrated embodiment, the pickup area 108 of the bridge 104 iscentrally located, generally flat, and circular. In addition, the bridge104 includes four arms, legs, cross braces, or cross members 112. Thearms/legs 112 are fixedly attached to the sidewalls 116 via connections122, which in this example comprise necked down or reduced thicknessportions to facilitate cutting or severing the connections 122.

The arms 112 are equally spaced apart (e.g., 90 degrees apart, etc.)about the perimeter of the pickup area 108. Each arm 112 may be fixedlyattached or releasably attached to a corresponding sidewall 116 of theframe 100. The bridge 104 and the frame's inwardly extending flange,rim, or lip may define four openings or windows. In other exemplaryembodiments, there may be more or less openings in different sizesand/or shapes than what is illustrated in the figures.

In some embodiments, the arms 112 of the bridge 104 interconnect thesidewalls 116 and may provide stiffening support to the frame 100, forexample, to resist deformation (e.g., bending, etc.) during handling bypick and place automation. Having the arms 112 attached to the sidewalls116 in this exemplary manner at four different locations 122 providesgreat stability, helps resists deformation of the frame 100 in the X andY lateral directions, and/or helps the bridge 104 remain attached to theframe 100 when carried by pick and place equipment. The arms 112 mayalso be configured to help maintain the side walls 116 in the generallyrectangular shape of the frame 100 during such handling and installationto the PCB. In other exemplary embodiments, the arms 112 of the bridge104 may extend from other locations of the sidewalls 116. Or, the bridge104 may include more than or less than four arms 112 and/or arms indifferent orientations and/or arms attached to the sidewalls in more orless than four locations depending, for example, on the frameconfiguration (e.g., size, shape, mass, etc.). For example, FIG. 12illustrates an exemplary embodiment of a BLS frame or fence 400 thatincludes a removable pick and place bridge 404 having a pick and placeisland 408 with three arms or legs 412 releasably attached viainterlocks 422 to the frame's sidewalls 416.

Alternative embodiments may include a bridge having a differentconfiguration, such as a pickup area with a different configuration(e.g., non-circular, offset from center, etc.) and/or differentlyconfigured arms (e.g., more or less than four, non-planar, non-flat,etc.) For example, another embodiment may include a bridge releasablyattached to a frame where the bridge includes only two arms that extendoutwardly from a pickup area to opposing sidewalls of the frame. In thisexample, the bridge extends between only the pair of opposing sidewallsand not all four sidewalls.

The bridge 104 and frame 100 may be formed from a single piece ofelectrically-conductive material (e.g., single blank of material, etc.)so that the frame's side walls 116 and bridge 104 have an integral,monolithic construction. A wide range of electrically-conductivematerials may be used to form the bridge 104 and frame 100. In anexemplary embodiment, a flat profile pattern for the frame 100 andbridge 104 may be stamped into a piece of material. The frame'ssidewalls 116 and bridge 104 may then be formed, bent, drawn, shaped,folded, etc. into the configuration shown in FIGS. 1 through 4. Eventhough the frame 100 and bridge 104 may be integrally formed (e.g.,stamping and bending/folding/drawing, etc.) from the same piece ofmaterial substantially simultaneously in this example, such is notrequired for all embodiments.

The illustrated frame 100 includes an inwardly extending rim, flange, orlip 124 defining the upper surface of the frame 100. But other exemplaryembodiments may include a frame with a flangeless construction withoutan inwardly extending lip, rim, or flange.

With further regard to the frame 100, the four sidewalls 116 arearranged such that the frame 100 is generally rectangular in shape. Inother exemplary embodiments, the frame 100 may include more or less thanfour sidewalls 116 and/or sidewalls in a configuration different fromthat shown in the figures. For example, the sidewalls 116 may have asquare configuration, a triangular configuration, a hexagonalconfiguration, another polygonal-shaped configuration, a circularconfiguration, a non-rectangular configuration, etc.

FIG. 4 is a front view of the BLS frame 100 showing the relative heightof the island 108 above the top 126 of the front sidewall 116 after theisland 108 has been raised during the drawing process. FIG. 4 also showscircular holes 128 and 130 (broadly, openings), respectively, along thefront and back sidewalls. The front and back holes 128, 130 may bestaggered in this exemplary embodiment such that the holes 130 along theback sidewall 116 would be hidden from view by the front sidewall 116.

The bridge 104 may be removed or detached (e.g., cut, releasablydetached, etc.) from the frame 100. A lid or cover may be positionedover the frame 100 to cover the open top of the frame 100. The cover andthe frame 100 may be used to enclose and provide EMI shielding forcomponents on a PCB. The lid or cover may include dimples, detents, orprotrusions (broadly, portions) configured to be releasably receivedwithin the holes 128, 130 along the frame's sidewalls 116 to therebyreleasably attach the lid or cover to the BLS frame 100. The lid orcover may be removable from and reattachable to the BLS frame 100.Alternative embodiments may include other means for attaching a lid orcover to a BLS frame.

FIGS. 5, 6, and 7 illustrate an exemplary embodiment of a BLS frame orfence 200 that includes a pick and place bridge 204 (broadly, a pickupmember) having a pick and place island 208 (broadly, a pickup area).FIG. 5 shows the frame 200 before the bridge 204 has been drawn to raiseto island 208. FIG. 6 shows the BLS frame 200 after the bridge 204 hasbeen drawn and the island 208 was raised and allowed to rotate in place(e.g., counterclockwise rotation in the X-Y plane without anytranslational linear motion of the center of the island in either the Xor Y directions, etc.) during the drawing process.

By way of example only, the length of a bridge arm 212 (broadly, member)shown in FIGS. 5 and 6 may be 13.1928 millimeters (mm) and 13.4548 mm,respectively, before and after the drawing process. Also by way ofexample only, the exemplary draw shown in FIG. 7 may be 0.7 mm.

FIG. 8 illustrates an exemplary offset of an arm-to-island attachment ofa bridge according to an exemplary embodiment. By way of example, FIG. 8shows a starting location of the island attachment point that is offsetby 0.125 mm from center. FIG. 8 also shows the reduced width of thearm-to-island attachment as compared to the arm width. This attachmentof the arms/legs are offset from the centerline of the circular pickupisland circle. By being offset, the drawing process creates a momentfrom which, when the arm/leg is put under tension, the pickup island isrotated instead of stretching the arm/leg. The dimensions show in FIG. 8and other dimensions are example in nature and do not limit the scope ofthe present disclosure.

FIGS. 9, 10, and 11 illustrate an exemplary embodiment of a BLS frame orfence 300 that includes a pick and place bridge 304 (broadly, a pickupmember) having a pick and place island 308 (broadly, a pickup area) andfour arms or legs 312 (broadly, members). The bridge 304 has been drawnand the island 308 was allowed to rotate in place with counterclockwiserotation in the X-Y plane without any (or without any significant)translational linear motion of the center of the island 308 in eitherthe X or Y directions.

In FIG. 9, U refers to displacement in millimeters (mm) with the U1, U2,etc. corresponding to different axes. U1 corresponds to the x axis. FIG.9 shows positive displacement of the lower horizontal leg, and negativedisplacement of the upper horizontal leg. FIG. 9 also shows that thelocation of the center of the pickup area 308 doesn't change.Advantageously, this allows for predictable movement—or lack thereof—ofthe pickup area 308 after the bridge 304 is formed (e.g., drawn, etc.)to the raised position.

In FIGS. 10 and 11, S refers to stress with the type being Von Misses inmegapascals (MPa). As shown, there is relatively low residual stressafter the bridge 304 is formed (e.g., drawn, etc.) to the raisedposition. This positively impacts the ability to hold flatness anddimensional tolerances on the overall BLS frame 100.

FIG. 12 illustrates an exemplary embodiment of a BLS frame or fence 400that includes a removable pick and place bridge 404 (broadly, a pickupmember) having a pick and place island 408 (broadly, a pickup area) andthree arms or legs 412 (broadly, members). The arms or legs 412 arereleasably attached to the frame's sidewalls 416 via interlocks 422.

The BLS frame 400 includes a rigid corner feature or reinforcement 432at or along the internal corner 436, which improves co-planarity andrigidity. Flanges 440 were added to the other bent areas of theseinternal walls 444 to improve rigidity as well.

To position the pickup area or island 408 close to or at about close thecenter of the BLS frame 400, the three attachment points 422 werepositioned accordingly. And, the legs 412 were configured to benon-linear (e.g., angled, slanted, curved, etc.) to help inhibitadditional stress on the pick bridge legs 412, which might otherwisecause warpage during manufacturing that would affect overall dimensions.In this exemplary embodiment, each of the three legs 412 defined anon-linear or angled pathway from the corresponding frame sidewall 416to the pickup area or island 408. And, each non-linear or angled pathwayof one leg 412 was different than the non-linear or angled pathwaydefined by the other two legs.

The features of the BLS frame 400 may allow for improvedmanufacturability and performance as far as co-planarity, rigidity areconcerned, and experience less stress/deformation during forming ascompared to conventional board level shields. It can be challenging toproduce conventional multi-compartment shields with co-planarity tomatch the outer frame of the shield. Low height requirements andremovable pick bridges can further complicate the design and challengeof manufacturing these features.

Results from a finite element analysis (FEA) are provided for purpose ofillustration only as other exemplary embodiments may be configureddifferently, e.g., with a differently configured pick and place bridge,with more or less than four bridge arms, with a non-circular pick andplace island, with a non-centered pick and place island, with anon-rectangular BLS, have different residual stresses after or duringthe drawing process, etc. For an example finite element analysis (FEA)showing (Von) Mises stresses on a pick and place bridge (broadly, apickup member) during a drawing process, the bridge included a pick andplace island (broadly, a pickup area) that was allowed to rotate inplace during the drawing process (e.g., with counterclockwise rotationin the X-Y plane without any (or with any significant)translational/linear motion of the center of the island in either the Xor Y directions, etc.).

By way of example only, the FEA modeling included the followingconditions or parameters. The material was ½ hard 770 Nickel Silver witha thickness of 0.2 millimeters (mm). The draw depth was 0.7 mm at 45degree angle. The BLS flange width was 1 mm. The bridge arm width was1.4 mm. The BLS length was 30 mm. Friction was assumed to be low and wasset to 0.1. The BLS flange was pinned down on all four sides for holdingthe material in place, thereby simulating bent walls and/or pressurepads.

By way of example only, CAD Modeling (FIGS. 5 through 8) predicted thatthe change in arm length for the 0.7 mm draw (at 45 degrees) was 0.262mm. The length of the illustrated bridge arm 212 before the draw was13.1928 mm. The length of the illustrated bridge arm 212 after the drawwas 13.4548 mm. Accordingly, the difference in length before and afterthe draw was about 0.262 mm. Dividing the change in length 0.262 mm inhalf (or dividing by two) and then rounding to an even number predictedthe starting location of each island attachment point. In an exemplaryembodiment, the predicted starting location of each island attachmentpoint was about 0.125 mm from the center of the circular pick up area orisland (FIG. 8).

The FEA analysis predicted that allowing the center island to rotate(e.g., using rotating cam connections, etc.) will allow the arms to move0.175 mm. Therefore, the change in length (of the drawn arms) is reducedby 0.087 mm (material elongation, as calculated by 0.262 mm−0.175mm=0.087 mm). This is about a two-thirds reduction in arm materialelongation, which reduction will reduce the residual stress on the part.

In some exemplary embodiments, the pickup member or bridge may bereleasably attached to the frame. After the bridge is removed ordetached from the frame, a lid or cover may be positioned over the frameto cover the open top of the frame. At which point, the cover and theframe may be used to enclose and provide EMI shielding for components ona PCB.

By way of example, the pickup member (e.g., pickup member 404 in FIG.12, etc.) may detachable and completely separable from the frame withouthaving to deform or cut the frame after the frame is installed (e.g.,soldered, etc.) on a substrate such that the frame remains installed onthe substrate without the pickup member. Each arm of the pickup membermay be releasably attached to the corresponding sidewalls of the frameby an interlock. The interlock may comprise a first interlocking memberintegrally defined by an arm of the pickup member and downwardlydepending relative to an end portion of the arm. The interlock mayfurther comprise a second interlocking member integrally defined by thecorresponding sidewall of the frame and upwardly protruding relative tothe first interlocking member. The interlock may also comprise anopening to accommodate movement of the first interlocking memberinwardly relative to the opening, thereby allowing continued upwardmovement of the first interlocking member relative to the secondinterlocking member for disengaging the interlock. Disengagement of theinterlock between each arm and the corresponding sidewall of the frameallows the pickup member to be detached and completely separated fromthe frame. The pickup member may be releasably attached to the framesuch that the pickup member is detachable and completely separable fromthe frame by moving the pickup member relatively away from the frameand/or without requiring any cutting, shearing, or distortion of theframe or pickup member. The releasable attachment of the pickup memberand the frame is within the footprint of the frame. The pickup memberand the frame may be integrally formed substantially simultaneously froma single blank of material with an interface formed between the pickupmember and the frame such that the pickup member is a detachable andcompletely separable part from the frame. A BLS cover may be made from adifferent piece of material than the single blank of material from whichthe pickup member and the frame are integrally formed. The cover may beonly attachable to the frame after the pickup member is removed from theframe. The pickup area may be a generally flat pickup area that enablesthe pickup member, and frame releasably attached thereto, to be pickedup by a suction nozzle or gripper associated with pick-and-placeequipment. End portions of the arms may be bent or angled upwardly afterbeing drawn so as to position the pickup area higher than the uppersurface of the frame. The higher positioning of the pickup area mayallow the frame and the pickup member to be placed over tallerelectronic components without the taller components contacting thepickup area. The frame may include flanges or it may have a flangelessconstruction. The pickup member may allow the pickup member and theframe to be picked up with pick-and-place equipment, and to allow thepickup member to be detached and completely separated from the frameusing pick-and-place after the frame is installed to the substrate.Additional embossing or crimping operations may be performed across thejuncture or interface contact between the frame and the pickup member orbridge to help ensure retention of the frame to the bridge, for example,during handling, packaging, pick and place operations, and/or customerinstallation/solder reflow, etc. In some exemplary embodiments, thepickup member may be releasably attached to the frame as disclosed inU.S. Patent Application Publication U.S. 2013/0033843, which isincorporated herein by reference.

In some exemplary embodiments, the bridge and frame may be formed by acombination of fabricating processes including drawing over a die, andthen folding or bending part of the frame to produce the final desiredshape. In such embodiments, the frame may include corner sections havingdrawn portions and folded portions as disclosed in U.S. Pat. No.7,488,902, which is incorporated herein by reference.

In an exemplary embodiment, a method generally includes raising a pickuparea of a pickup member attached to a frame of a board level shield(BLS) relative to an upper surface of one or more sidewalls of theframe, such that the pickup area rotates in place as the pickup area israised relative to the upper surface of the one or more sidewalls.

Raising the pickup area may comprise rotating the pickup area in a planesuch that a height of the pickup area in a first direction perpendicularto the plane is increased relative to the upper surface of the one ormore sidewalls without substantially changing a location of the pickuparea in a direction parallel the plane. Raising the pickup area maycomprise rotating the pickup area in an X-Y plane such that the pickuparea is moved in a Z direction relative to the upper surface of the oneor more sidewalls without substantially moving the pickup area in eitherthe X or Y directions. Rotating the pickup area comprises clockwise orcounterclockwise rotation of the pickup area about an axis without anytranslational motion of the pickup area in a direction perpendicular tothe axis.

The rotation of the pickup area in place as the pickup area is raisedrelative to the upper surface of the one or more sidewalls may reduceneeded elongation of the pickup member and may reduce residual and/orforming stresses.

Raising the pickup area may comprise forming the pickup member tothereby reshape the pickup member without adding or removing material.

Raising the pickup area may comprise drawing the pickup member.

The attachment of the pickup area to the pickup member may be offsetfrom a centerline of the pickup area such that the pickup area isgenerally centered relative to a center of mass of the frame and/or to afootprint defined by the one or more sidewalls both before and after theraising and rotation in place of the pickup area.

The pickup member may include one or more arms each extending generallybetween the pickup member and a corresponding one of the one or moresidewalls of the frame.

The pickup member may be configured such that the pickup area isgenerally centered relative to a center of mass of the frame and/or to afootprint defined by the one or more sidewalls both before and after theraising and rotation in place of the pickup area.

Raising the pickup area may include forming a portion in each of the oneor more arms that extends upwardly at an angle between a connection ofthe corresponding arm to the frame such that the pickup area is higherthan the one or more sidewalls of the frame thereby providing greaterclearance for components under the pickup area, whereby the portionallows an upper surface of the arm between the connection and the pickuparea to be substantially co-planar with an upper surface of the pickupmember and allows the connection to be substantially co-planar with anupper surface of the one or more sidewalls.

Raising the pickup area may comprise maintaining co-planarity of anupper surface of the pickup area with an upper surface of the one ormore arms before and after raising the raising and rotation in place ofthe pickup area.

An attachment between each of the one or more arms and the pickup areamay be offset from a centerline of the pickup area. The offset may beconfigured to create a moment from which, when the arm is put undertension during the raising of the pickup area, the pickup area isrotated instead of elongating the arm.

The one or more sidewalls of the frame may comprise four sidewalls. Theone or more arms may comprise three arms each extending between acorresponding one of the four sidewalls and the pickup area, or fourarms each extending between a corresponding one of the four sidewallsand the pickup area.

The one or more arms may be releasably attached to the one or moresidewalls by one or more interlocks. The frame may include one or moreinternal walls, reinforcement along an internal corner defined by theone or more internal walls, and flanges along the one or more internalwalls. The one or more arms may be non-linear.

The method may further comprise picking up the frame by the pickupmember attached to the frame and placing the frame on a substrate forinstallation to the substrate generally about one or more components onthe substrate to be shielded; removing the pickup member from the frameafter raising the pickup area; and attaching a cover to the frame,whereby the frame and cover are operable for shielding the one or morecomponents on the substrate that are within an interior cooperativelydefined by the frame and the cover.

The pickup member may be integrally formed with and fixedly attached tothe frame. Or, the pickup member may be integrally formed with andremovably attached to the frame, and removing the pickup member from theframe comprises using pick-in-place equipment to move the pickup memberrelatively away from the frame without cutting, shearing, or breaking ofmaterial integrally forming the pickup member and frame.

In an exemplary embodiment, a shielding apparatus generally includes aframe and a pickup member. The frame includes one or more sidewallsconfigured for installation to a substrate generally about one or morecomponents on the substrate. The pickup member includes a pickup area.The pickup area is rotatable in place when the pickup area is raisedrelative to an upper surface of the one or more sidewalls.

The pickup member may include one or more arms each extending generallybetween the pickup member and a corresponding one of the one or moresidewalls of the frame. A connection between each of the one or morearms and the pickup area may be offset from a centerline of the pickuparea. The offset may be configured to create a moment from which, whenthe corresponding arm is put under tension during the raising of thepickup area, the pickup area is rotated instead of elongating the arm.

The pickup member may be configured such that the pickup area isgenerally centered relative to a center of mass of the frame and/or to afootprint defined by the one or more sidewalls both before and after thepickup area is raised and rotated in place. The pickup member may beconfigured such that co-planarity is maintained for an upper surface ofthe pickup area with an upper surface of the one or more arms before andafter the pickup area is raised and rotated in place.

The pickup member may be configured such that a portion in each of theone or more arms extends upwardly at an angle between the connection ofthe corresponding arm to the frame after the pickup area is raised androtated in place such that the pickup area higher than the one or moresidewalls of the frame thereby providing greater clearance forcomponents under the pickup area. The portion may allow an upper surfaceof the arm between the connection and the pickup area to besubstantially co-planar with an upper surface of the pickup member andmay allow the connection to be substantially co-planar with an uppersurface of the one or more sidewalls.

The one or more sidewalls of the frame may comprise four sidewalls. Theone or more arms may comprise three arms each extending between acorresponding one of the four sidewalls and the pickup area, or fourarms each extending between a corresponding one of the four sidewallsand the pickup area.

The one or more arms may be releasably attached to the one or moresidewalls by one or more interlocks. The frame may include one or moreinternal walls, reinforcement along an internal corner defined by theone or more internal walls, and flanges along the one or more internalwalls. The one or more arms may be non-linear.

The pickup member may be integrally formed with and fixedly attached tothe frame. Or, the pickup member may be integrally formed with andreleas ably detachable from the frame, such that the pickup member isdetachable and completely separable from the frame without cutting,shearing, or breaking of material integrally forming the pickup memberand the frame.

The pickup member may be configured such that the pickup area isrotatable in a plane such that a height of the pickup area in a firstdirection perpendicular to the plane is increasable relative to theupper surface of the one or more sidewalls without substantiallychanging a location of the pickup area in a direction parallel theplane.

The pickup member may be configured such that the pickup area isrotatable in an X-Y plane such that the pickup area is movable in a Zdirection relative to the upper surface of the one or more sidewallswithout substantially moving the pickup area in either the X or Ydirections.

The pickup member may be configured such that the pickup area isrotatable clockwise or counterclockwise about an axis without anytranslational motion of the pickup area in a direction perpendicular tothe axis.

The pickup member may be configured such that rotation of the pickuparea in place as the pickup area is raised relative to the upper surfaceof the one or more sidewalls may reduce needed elongation of the pickupmember and may reduce residual and/or forming stresses.

The attachment of the pickup area to the pickup member may be offsetfrom a centerline of the pickup area such that the pickup area isgenerally centered relative to a center of mass of the frame and/or to afootprint defined by the one or more sidewalls both before and after thepickup area is raised and rotated in place.

A board level shield may include the frame, the pickup member, and acover. The cover may be releasably detachable from and reattachable tothe frame after removal of the pickup member. The frame and the covermay be operable for shielding the one or more components on thesubstrate that are within an interior cooperatively defined by the frameand the cover.

Example embodiments are provided so that this disclosure will bethorough, and will fully convey the scope to those who are skilled inthe art. Numerous specific details are set forth such as examples ofspecific components, devices, and methods, to provide a thoroughunderstanding of embodiments of the present disclosure. It will beapparent to those skilled in the art that specific details need not beemployed, that example embodiments may be embodied in many differentforms, and that neither should be construed to limit the scope of thedisclosure. In some example embodiments, well-known processes,well-known device structures, and well-known technologies are notdescribed in detail. In addition, advantages and improvements that maybe achieved with one or more exemplary embodiments of the presentdisclosure are provided for purpose of illustration only and do notlimit the scope of the present disclosure, as exemplary embodimentsdisclosed herein may provide all or none of the above mentionedadvantages and improvements and still fall within the scope of thepresent disclosure.

Specific dimensions, specific materials, and/or specific shapesdisclosed herein are example in nature and do not limit the scope of thepresent disclosure. The disclosure herein of particular values andparticular ranges of values for given parameters are not exclusive ofother values and ranges of values that may be useful in one or more ofthe examples disclosed herein. Moreover, it is envisioned that any twoparticular values for a specific parameter stated herein may define theendpoints of a range of values that may be suitable for the givenparameter (i.e., the disclosure of a first value and a second value fora given parameter can be interpreted as disclosing that any valuebetween the first and second values could also be employed for the givenparameter). For example, if Parameter X is exemplified herein to havevalue A and also exemplified to have value Z, it is envisioned thatparameter X may have a range of values from about A to about Z.Similarly, it is envisioned that disclosure of two or more ranges ofvalues for a parameter (whether such ranges are nested, overlapping ordistinct) subsume all possible combination of ranges for the value thatmight be claimed using endpoints of the disclosed ranges. For example,if parameter X is exemplified herein to have values in the range of1-10, or 2-9, or 3-8, it is also envisioned that Parameter X may haveother ranges of values including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3,3-10, and 3-9.

The terminology used herein is for the purpose of describing particularexample embodiments only and is not intended to be limiting. As usedherein, the singular forms “a”, “an” and “the” may be intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. The terms “comprises,” “comprising,” “including,” and“having,” are inclusive and therefore specify the presence of statedfeatures, integers, steps, operations, elements, and/or components, butdo not preclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof. The method steps, processes, and operations described hereinare not to be construed as necessarily requiring their performance inthe particular order discussed or illustrated, unless specificallyidentified as an order of performance. It is also to be understood thatadditional or alternative steps may be employed.

When an element or layer is referred to as being “on”, “engaged to”,“connected to” or “coupled to” another element or layer, it may bedirectly on, engaged, connected or coupled to the other element orlayer, or intervening elements or layers may be present. In contrast,when an element is referred to as being “directly on,” “directly engagedto”, “directly connected to” or “directly coupled to” another element orlayer, there may be no intervening elements or layers present. Otherwords used to describe the relationship between elements should beinterpreted in a like fashion (e.g., “between” versus “directlybetween,” “adjacent” versus “directly adjacent,” etc.). As used herein,the term “and/or” includes any and all combinations of one or more ofthe associated listed items.

The term “about” when applied to values indicates that the calculationor the measurement allows some slight imprecision in the value (withsome approach to exactness in the value; approximately or reasonablyclose to the value; nearly). If, for some reason, the imprecisionprovided by “about” is not otherwise understood in the art with thisordinary meaning, then “about” as used herein indicates at leastvariations that may arise from ordinary methods of measuring or usingsuch parameters. For example, the terms “generally”, “about”, and“substantially” may be used herein to mean within manufacturingtolerances.

Although the terms first, second, third, etc. may be used herein todescribe various elements, components, regions, layers and/or sections,these elements, components, regions, layers and/or sections should notbe limited by these terms. These terms may be only used to distinguishone element, component, region, layer or section from another region,layer or section. Terms such as “first,” “second,” and other numericalterms when used herein do not imply a sequence or order unless clearlyindicated by the context. Thus, a first element, component, region,layer or section could be termed a second element, component, region,layer or section without departing from the teachings of the exampleembodiments.

Spatially relative terms, such as “inner,” “outer,” “beneath”, “below”,“lower”, “above”, “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. Spatiallyrelative terms may be intended to encompass different orientations ofthe device in use or operation in addition to the orientation depictedin the figures. For example, if the device in the figures is turnedover, elements described as “below” or “beneath” other elements orfeatures would then be oriented “above” the other elements or features.Thus, the example term “below” can encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

The foregoing description of the embodiments has been provided forpurposes of illustration and description. It is not intended to beexhaustive or to limit the disclosure. Individual elements, intended orstated uses, or features of a particular embodiment are generally notlimited to that particular embodiment, but, where applicable, areinterchangeable and can be used in a selected embodiment, even if notspecifically shown or described. The same may also be varied in manyways. Such variations are not to be regarded as a departure from thedisclosure, and all such modifications are intended to be includedwithin the scope of the disclosure.

What is claimed is:
 1. A method comprising raising a pickup area of apickup member including one or more arms extending between the pickuparea and one or more sidewalls of a frame of a board level shield (BLS),such that the pickup area is raised relative to and above an uppersurface of the one or more sidewalls of the frame, and such that thepickup area rotates in place as the pickup area is raised relative toand above the upper surface of the one or more sidewalls, whereinraising the pickup area comprises rotating the pickup area in an X-Yplane such that the pickup area is moved in a Z direction relative tothe upper surface of the one or more sidewalls without moving a locationof the pickup area in either the X or Y directions.
 2. A methodcomprising raising a pickup area of a pickup member including one ormore arms extending between the pickup area and one or more sidewalls ofa frame of a board level shield (BLS), such that the pickup area israised relative to and above an upper surface of the one or moresidewalls of the frame, and such that the pickup area rotates in placeas the pickup area is raised relative to and above the upper surface ofthe one or more sidewalls, wherein raising the pickup area comprisesrotating the pickup area in a plane such that a height of the pickuparea in a first direction perpendicular to the plane is increasedrelative to the upper surface of the one or more sidewalls withoutchanging a location of the pickup area in a direction parallel theplane.
 3. The method of claim 1, wherein rotating the pickup areacomprises clockwise or counterclockwise rotation of the pickup areaabout an axis without any translational motion of the pickup area in adirection parallel to the clockwise or counterclockwise rotation.
 4. Themethod of claim 2, wherein rotating the pickup area comprises clockwiseor counterclockwise rotation of the pickup area about an axis withoutany translational motion of the pickup area in a direction parallel tothe clockwise or counterclockwise rotation.
 5. The method of claim 1,wherein: an attachment between each said arm and the pickup area isoffset from a centerline of the pickup area; and raising the pickup areaincludes rotating the pickup area in place as the pickup area is raisedrelative to and above the upper surface of the one or more sidewalls,whereby the offset creates a moment from which, when the correspondingarm is put under tension during the raising of the pickup area, thepickup area is rotated instead of elongating the arm.
 6. The method ofclaim 1, wherein raising the pickup area comprises forming the pickupmember to thereby reshape the pickup member without adding or removingmaterial.
 7. The method of claim 1, wherein the pickup member isconfigured such that the pickup area is centered relative to a center ofmass of the frame both before and after the raising and rotation of thepickup area.
 8. The method of claim 1, wherein the pickup area isattached to the pickup member, and wherein the attachment of the pickuparea to the pickup member is offset from a centerline of the pickup areasuch that the pickup area is centered relative to a center of mass ofthe frame both before and after the raising and rotation of the pickuparea.
 9. The method of claim 1, wherein raising the pickup area includesforming a portion in each of the one or more arms that extends upwardlyat an angle between a connection of the corresponding arm to the framesuch that the pickup area is higher than the one or more sidewalls ofthe frame thereby providing greater clearance for components under thepickup area, whereby the portion allows an upper surface of the armbetween the connection and the pickup area to be co-planar with an uppersurface of the pickup member and allows the connection to be co-planarwith an upper surface of the one or more sidewalls.
 10. The method ofclaim 1, wherein an attachment between each of the one or more arms andthe pickup area is offset from a centerline of the pickup area.
 11. Themethod of claim 10, wherein the offset is configured to create a momentfrom which, when the arm is put under tension during the raising of thepickup area, the pickup area is rotated instead of elongating the arm.12. The method of claim 1, wherein: the one or more sidewalls of theframe comprise four sidewalls, and the one or more arms comprise: threearms each extending between a corresponding one of the four sidewallsand the pickup area, or four arms each extending between a correspondingone of the four sidewalls and the pickup area.
 13. The method of claim1, further comprising: picking up the frame by the pickup memberattached to the frame and placing the frame on a substrate forinstallation to the substrate about one or more components on thesubstrate to be shielded; removing the pickup member from the frameafter raising the pickup area; and attaching a cover to the frame,whereby the frame and cover are operable for shielding the one or morecomponents on the substrate that are within an interior cooperativelydefined by the frame and the cover, and wherein: the pickup member isintegrally formed with and fixedly attached to the frame; or the pickupmember is integrally formed with and removably attached to the frame,and removing the pickup member from the frame comprises usingpick-in-place equipment to move the pickup member relatively away fromthe frame without cutting, shearing, or breaking of material integrallyforming the pickup member and frame.
 14. The method of claim 1, whereinraising the pickup area comprises drawing the pickup member.
 15. Themethod of claim 1, wherein: the one or more sidewalls comprise aplurality of sidewalls defining a footprint; the pickup area is attachedto the pickup member; and the attachment of the pickup area to thepickup member is offset from a centerline of the pickup area such thatthe pickup area is centered relative to the footprint defined by theplurality of sidewalls both before and after the raising and rotation ofthe pickup area.
 16. The method of claim 1, wherein raising the pickuparea comprises maintaining co-planarity of an upper surface of thepickup area with an upper surface of the one or more arms before andafter raising the raising and rotation of the pickup area.
 17. Themethod of claim 1, wherein the one or more arms are releasably attachedto the one or more sidewalls by one or more interlocks.
 18. The methodof claim 1, wherein the frame includes one or more internal walls,reinforcement along an internal corner defined by the one or moreinternal walls, and flanges along the one or more internal walls. 19.The method of claim 1, wherein the one or more arms are non-linear.